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CK990/SN

Clip heatsink for semiconductor case TO 220 Fixing (solderable) in PCB by tinned pins.

For device: TO 220
Device mounted by: Stick
Heatsink mounted by: Soldering
Surface Verzinnt
Material AlMg3

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FE372/10/AL

Special-Heatsink for semiconductor in cases TO5/39 Standardhighs: 6,8, and 10 mm. Other highs or special surfaces on request.

For device: TO5|TO 39
Minimum thermal resistance 44 K/W
Device mounted by: Stick
Heatsink mounted by: Aufstecken
Surface Blank Aluminium
Material AlMgSi0,5

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FE372/6/AL

Special-Heatsink for semiconductor in cases TO5/39 Standardhighs: 6, 8 and 10 mm. Other highs or special surfaces on request.

For device: TO 5|TO 39
Minimum thermal resistance 63 K/W
Device mounted by: Stick
Heatsink mounted by: Aufstecken
Surface Blank Aluminium
Material AlMgSi0,5

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FE372/8/Al

Standard heat sink for single device mounting Standardhighs: 6, 8 and 10 mm. Other highs or special surfaces on request.

Length [mm] 9
For device: TO 5|TO 39
Minimum thermal resistance 54 K/W
Device mounted by: Stick
Heatsink mounted by: Aufstecken
Surface Blank Aluminium
Material AlMgSi0,5

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CK632/SE

Standard heat sink for single device mounting Fixing by stop-mark

Width [mm] 6,8
Height [mm] 20,7
Length [mm] 20,1
For device: TO126 (SOT32)
Minimum thermal resistance 22 K/W
Device mounted by: Stick
Heatsink mounted by: Aufstecken
Surface Black Anodised
Material AlMg3

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PR7/8,5/SE

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive type WK 709. - Standard length: 8,5 mm for 6/8 pins - Other...

Width [mm] 6,4
Height [mm] 4,8
Length [mm] 8,5
For device: DIL 6/8 polig
Minimum thermal resistance 80 K/W
Device mounted by: kleben
Heatsink mounted by: kleben
Surface schwarz eloxiert
Material AlMgSi0,5

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PR7/19/SE

Aus Aluminium zum aufkleben. (Siehe Wärmeleitkleber WK 709) Standardlänge: 19,0 mm für 14/16 polig.

Width [mm] 6,3
Height [mm] 4,8
Length [mm] 19
For device: DIL 14/16 polig
Minimum thermal resistance 46 K/W
Device mounted by: Adhesive Bonding
Heatsink mounted by: Adhesive Bonding
Surface Black Anodised
Material AlMgSi0,5
Base height [mm] 1

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PR7/23/SE

Aus Aluminium zum aufkleben. (Siehe Wärmeleitkleber WK 709) Standardlänge: 23,0 mm für 16 polig.

Width [mm] 6,3
Height [mm] 4,8
Length [mm] 23
For device: DIL
Minimum thermal resistance 40,0 K/W
Device mounted by: Adhesive Bonding
Heatsink mounted by: Adhesive Bonding
Surface Black Anodised
Material AlMgSi0,5
Base height [mm] 1

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CK970

Standard heat sink for single device mounting

Width [mm] 11,4
Height [mm] 13,8
Length [mm] 12,7
For device: TO 92
Minimum thermal resistance 40,0 K/W
Device mounted by: Stick
Heatsink mounted by: Soldering
Surface Blank Aluminium
Material Brass

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FI342/SE

Special heatsink for semiconductor case TO 220. Mounting horizontal on PCB by solderable pins. Black anodized

Width [mm] 12,7
Height [mm] 12,7
Length [mm] 16
For device: TO 220
Minimum thermal resistance 25 K/W
Device mounted by: stecken
Heatsink mounted by: löten
Surface schwarz eloxiert
Material AlMgSi0,5

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PR10/11/SE

- U-extruded especially for semiconductor case TO126 (SOT32) - Standard types, ready to be fitted: - PR 10/11/SE = with M2,5-thread for standing and lying mounting - Also available in...

Width [mm] 12
Height [mm] 15
Length [mm] 11
For device: SOT 32|TO 126
Minimum thermal resistance 45 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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PR5/25/SE/LS

Standard heat sink for single mounting

Width [mm] 12,6
Height [mm] 6,5
Length [mm] 25
For device: TO 220
Minimum thermal resistance 32 K/W
Device mounted by: Screw On
Heatsink mounted by: Soldering
Surface Black Anodised
Material AlMgSi 0,5 F22

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