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PG2020/10/SE/SF

- Heatsinks for microprocessors (Extrusion Technology) - Direct mounting with self-adhesive foil - Best possible heat radiation from black anodized surface - RthKvalues apply to...

Width [mm] 20
Height [mm] 10
Length [mm] 20
For device: PGA|BGA|IC
Minimum thermal resistance 18 K/W
Device mounted by: Adhesive Bonding
Heatsink mounted by: Adhesive Bonding

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CK980/AL

Standard heat sink for single device mounting

Width [mm] 22
Height [mm] 19
Length [mm] 11
For device: TO 220
Minimum thermal resistance 24,0 K/W
Device mounted by: Stick
Heatsink mounted by: Aufstecken
Surface Blank Aluminium
Material Al99,5

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CK980/SE

Standard heat sink for single device mounting

Width [mm] 22
Height [mm] 19
Length [mm] 11
For device: TO 220
Minimum thermal resistance 21 K/W
Device mounted by: Stick
Heatsink mounted by: Aufstecken
Surface Black Anodised
Material Al99,5

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CK985/SN

- Clip heatsink for semiconductor case TO 220 - Fixing (solderable) in PCB by tinned pins.

Width [mm] 22
Height [mm] 19
Length [mm] 11
For device: TO 220
Minimum thermal resistance 20 K/W
Device mounted by: Stick
Heatsink mounted by: Soldering
Surface Verzinnt
Material AlMg3

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FI300/SE

Standard heat sink for single device mounting

Width [mm] 22
Height [mm] 31,6
Length [mm] 4
For device: TO 220
Minimum thermal resistance 27 K/W
Device mounted by: Screw On
Heatsink mounted by: Aufstecken
Surface Black Anodised
Material Al99,5

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FI300/SN

Standard heat sink for single device mounting

Width [mm] 22
Height [mm] 31,6
Length [mm] 4
For device: TO 220
Minimum thermal resistance 29,5 K/W
Device mounted by: Screw On
Heatsink mounted by: Soldering
Surface Verzinnt
Material Al99,5

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FI355/11/SE

Finger shaped heatsink, for semiconductor case TO 220. For screw and rivet mounting Turbulence in every installation position

Width [mm] 22
Height [mm] 19,2
Length [mm] 11
For device: TO 220
Minimum thermal resistance 30 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material Al99,5

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PR6/26/SE/LS

- Extruded heatsink especially for semiconductor case TO220 - Aluminium, anodised black - Standard type, ready to be fitted - PR 6/26/SE/LS = 26 mm, solderable with tinned pin - Other...

Width [mm] 22
Height [mm] 12
Length [mm] 26
For device: TO 220
Minimum thermal resistance 14 K/W
Device mounted by: Screw On
Heatsink mounted by: Soldering
Surface Black Anodised
Material AlMgSi0,5

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FI355/19/SE

Finger shaped heatsink, for semiconductor case TO 220. For screw and rivet mounting Turbulence in every installation position

Width [mm] 22
Height [mm] 19,2
Length [mm] 19
For device: TO 220
Minimum thermal resistance 21 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material Al99,5

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FI302/SE

Special heatsink for semiconductor case TO 220. For screw and rivet mounting. Fixing in PCB by pins. Finish SE = black anodized Finish SN = tin plated, solderable.

Width [mm] 24
Height [mm] 20
Length [mm] 7
For device: TO 220
Minimum thermal resistance 21 K/W
Device mounted by: Screw On
Heatsink mounted by: Aufstecken
Surface Black Anodised
Material Al99,5

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FI302/SN

Special heatsink for semiconductor case TO 220. For screw and rivet mounting. Fixing in PCB by pins. Finish SE = black anodized Finish Sn = tin plated, solderable.

Width [mm] 24
Height [mm] 20
Length [mm] 7
For device: TO 220
Minimum thermal resistance 23,5 K/W
Device mounted by: Screw On
Heatsink mounted by: Soldering
Surface Verzinnt
Material Al99,5

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PR21/35/SE

- Extruded heatsink especially for semiconductor case TO220. - Standard type, ready to be fitted: - PR 21/20/SE = with 3,5 mm hole for standing and lying mounting - PR 21/35/SE = with...

Width [mm] 24,7
Height [mm] 12,5
Length [mm] 35
For device: TO 220
Minimum thermal resistance 9,5 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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