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PR17/35/II/SE

- U-extruded especially for semiconductor case TO220 or 2xSOT32(TO126). - Standard type, ready to be fitted: - PR 17/15/SE = with 3 mm hole for lying mounting - PR 17/25/SE = with...

Width [mm] 17
Height [mm] 13
Length [mm] 35
For device: TO 220
Minimum thermal resistance 21 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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PR17/50/SE

- U-extruded especially for semiconductor case TO220 or 2xSOT32(TO126). - Standard type, ready to be fitted: - PR 17/15/SE = with 3 mm hole for lying mounting - PR 17/25/SE = with...

Width [mm] 17
Height [mm] 13
Length [mm] 50
For device: TO 220
Minimum thermal resistance 21 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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PR18/15/SE

- U-extruded especially for semiconductor case TO220. - Standard type, ready to be fitted: - PR 18/15/SE = with 3 mm hole for standing and lying mounting - PR 18/25/SE = with M3-thread...

Width [mm] 18
Height [mm] 20
Length [mm] 15
For device: TO 220
Minimum thermal resistance 20 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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PR18/25/SE

- U-extruded especially for semiconductor case TO220. - Standard type, ready to be fitted: - PR 18/15/SE = with 3 mm hole for standing and lying mounting - PR 18/25/SE = with M3-thread...

Width [mm] 18
Height [mm] 20
Length [mm] 25
For device: TO 220
Minimum thermal resistance 17 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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PR18/35/SE

- U-extruded especially for semiconductor case TO220. - Standard type, ready to be fitted: - PR 18/15/SE = with 3 mm hole for standing and lying mounting - PR 18/25/SE = with M3-thread...

Width [mm] 18
Height [mm] 20
Length [mm] 35
For device: TO 220
Minimum thermal resistance 13 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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PR8/33/SE

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive type WK 709. - Standard length: - 6,3 mm for 14/16 pins - 33...

Width [mm] 18,9
Height [mm] 4,8
Length [mm] 33
For device: DIL
Minimum thermal resistance 13 K/W
Device mounted by: kleben
Heatsink mounted by: kleben
Surface schwarz eloxiert
Material AlMgSi0,5

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PR8/37/SE

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive type WK 709. - Standard length: - 6,3 mm for 14/16 pins - 33...

Width [mm] 18,9
Height [mm] 4,8
Length [mm] 37
For device: DIL
Minimum thermal resistance 11 K/W
Device mounted by: Adhesive Bonding
Heatsink mounted by: Adhesive Bonding
Surface Black Anodised
Material AlMgSi0,5

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PR8/47/SE

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive type WK 709. - Standard length: - 6,3 mm for 14/16 pins - 33...

Width [mm] 18,9
Height [mm] 4,8
Length [mm] 47
For device: DIL
Minimum thermal resistance 9,5 K/W
Device mounted by: Adhesive Bonding
Heatsink mounted by: Adhesive Bonding
Surface Black Anodised
Material AlMgSi0,5

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PR8/51/SE

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive type WK 709. - Standard length: - 6,3 mm for 14/16 pins - 33...

Width [mm] 18,9
Height [mm] 4,8
Length [mm] 51
For device: DIL
Minimum thermal resistance 8,5 K/W
Device mounted by: Adhesive Bonding
Heatsink mounted by: Adhesive Bonding
Surface Black Anodised
Material AlMgSi0,5

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PR8/6,3/SE

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive type WK 709. - Standard length: - 6,3 mm for 14/16 pins - 33...

Width [mm] 18,9
Height [mm] 4,8
Length [mm] 6,3
For device: DIL
Minimum thermal resistance 50 K/W
Device mounted by: Adhesive Bonding
Heatsink mounted by: Adhesive Bonding
Surface Black Anodised
Material AlMgSi0,5

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AK352/15/SE

Top-mounted and contact pressure heat sinks for optimised contact pressure and additional cooling - Reduced contact thermal resistance (RthGK) to the primary heat sink and avoidance of...

Width [mm] 20
Height [mm] 15
Length [mm] 15
For device: TO 218|TOP 3
Minimum thermal resistance 28 K/W
Device mounted by: Screw On
Heatsink mounted by: Screw On
Surface Black Anodised
Material AlMgSi0,5

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CK633/SE

Special heatsink for semiconductor case TO 220. For screw and rivet mounting. Fixing in PCB by pins. Finish SE = black anodized Finish SN = tin plated, solderable.

Width [mm] 20,3
Height [mm] 25,4
Length [mm] 6,8
For device: TO 220
Minimum thermal resistance 21 K/W
Device mounted by: Stick
Heatsink mounted by: Aufstecken
Surface Black Anodised
Material AlMg3

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